Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.
Contents
Episode show notes
Texas Instruments is a global semiconductor manufacturing company with expertise in analog and embedded processing chips. The company was founded in 1930 and headquartered in Dallas, Texas. In this episode we discuss:
- The benefits of using plastic packages vs. ceramic packaging
- These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
- The role that Texas Instruments has played in supporting the standardization of QMLP
- How and why TI will continue to offer QMLV-RHA (ceramic) packaging
- How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities